Capabilities
Custom Manufacturing
The below list of our manufacturing capabilities is just a sample of what we offer. Let us know your needs and one of our professional consultants will handle all your questions.
- · 1 thru 26 Layers
- · 6 mil smallest Via Hole
- · 3 mil Min Line Width
- · 3 mil Min Space Width
- · Board Thickness .008-.125
- · Minimum SMT Pitch: 4 mil
- · Controlled Impedance Tolerance 10%
- · Gold Finger Capability 30µm and -50µm
- · NC Routing, V-Cut Scoring, Punching
- · Via-In-Pad Capable
- · Blind and Buried Vias
- · Silver filled Vias
- · 5 oz copper outer layers, 3 oz copper inner layer
- · Solder Mask Colors: Green, Blue, Black, Red, White, Purple, Clear
- · Finishes: Leaded HASL, Immersion Gold, Immersion Silver, Lead Free HASL, OSP
- · Peel able Mask
- · Carbon Ink
- Materials
- · FR4
- · FR408
- · High Tg 150,
- · High Tg 170
- · CEM-1
- Specialty materials
- · Rogers, Arlon, Taconic.
Let’s work together on your next project
With dozens of years in the industry, we have the knowledge and experience to take your project from concept to completion, on time and on budget.