Manufacturing Capabilities
· 1 thru 26 Layers
· 6 mil smallest Via Hole
· 3 mil Min Line Width
· 3 mil Min Space Width
· Board Thickness .008-.125
· Minimum SMT Pitch: 4 mil
· Controlled Impedance Tolerance 10%
· Gold Finger Capability 30µm and -50µm
· NC Routing, V-Cut Scoring, Punching
· Via-In-Pad Capable
· Blind and Buried Vias
· Silver filled Vias
· 5 oz copper outer layers, 3 oz copper inner layer
· Solder Mask Colors: Green, Blue, Black, Red, White, Purple, Clear
· Finishes: Leaded HASL, Immersion Gold, Immersion Silver, Lead Free HASL, OSP
· Peel able Mask
· Carbon Ink
Materials
· FR4
· FR408
· High Tg 150,
· High Tg 170
· CEM-1
Specialty materials
· Rogers, Arlon, Taconic.
